{
	"title": "Intel(R) Solid State Drives, PCN 111609-01, Transport Media, Packaging Cushion Material Upgraded to Thermoformed HDPE (High Density Polyethylene) and Box/Pallet Dimension Changes, Reason for Revision: To Notify Additional Customers",
	"id": "809111",
	"created_at": "2023-12-21T16:55:07+00:00",
	"modified_at": "2012-10-26T11:53:00+00:00",
	"description": "Flash Memory Products, Transport Media, Intel anticipates no impact to customers, see PCN detail for further information.",
	"download_url": "https://cdrdv2-public.intel.com/809111/PCN111609-01.pdf",
	"html_url": "https://intel.com/content/www/us/en/content-details/809111/intel-r-solid-state-drives-pcn-111609-01-transport-media-packaging-cushion-material-upgraded-to-thermoformed-hdpe-high-density-polyethylene-and-box-pallet-dimension-changes-reason-for-revision-to-notify-additional-customers.html",
	"url": "https://intel.pcn.captnemo.in/pcn/809111",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/809111.json"
}