{
	"title": "MINOR CHANGE, Country of Wafer Level Assembly, PCN 826056-00, Transport Media, Label,  Interpretation of COO for Foveros Single Stack IC Products",
	"id": "826056",
	"created_at": "2024-07-23T03:24:11+00:00",
	"modified_at": "2024-07-22T20:24:07+00:00",
	"description": "Chipsets, Chipsets - Mobile, Chipsets - Desktop, Server Processors, Embedded Processors, Desktop Processors, Mobile Processors, Transport Media, Label,  see PCN detail for further information",
	"download_url": "https://cdrdv2-public.intel.com/826056/PCN826056-00.pdf",
	"html_url": "https://intel.com/content/www/us/en/content-details/826056/minor-change-country-of-wafer-level-assembly-pcn-826056-00-transport-media-label-interpretation-of-coo-for-foveros-single-stack-ic-products.html",
	"url": "https://intel.pcn.captnemo.in/pcn/826056",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/826056.json"
}